At first glance, the operators may assign the cause to a low concentration of the organic addition agent. Typically, when that assumption is made, the reaction is to add more organic addition agent to the plating solution, but that will cause additional harm to the functioning of the plating solution.
If the film is not forming properly, one may expect to see these types of nodules, as well as issues related to excessive consumption of the organic addition agents (brighteners, etc.).
High addition agent
content will always affect the surface, but levellers in high concentration will particularly affect paint adhesion.
Another component of the acid copper addition agent system will be high molecular weight polyether compounds, surfactants, polyoxyalkylene glycols, and others of similar structure.
Organic Addition Agents. There are a myriad of addition agents commercially available.
Additives are chemical addition agents
which are mixed in tiny quantities with coatings, inks and plastics and which serve to refine and finish paper surfaces.
It is easy to maintain using 2 solid addition agents
that can be added at the end of each working day, with the pH being the only critical parameter.
THE ORGANIC ADDITION agents serve several functions with respect to acid copper electrodeposits.
It is well understood that the organic addition agents utilized in acid copper plating processes influence the physical properties of the deposit and provide improved characteristics.
Last month we looked at some of the problems that can arise from the under-or over-dosing of addition agents
on bright nickel solutions.
These include too low an operating temperature, imbalance of key addition agents
or a combination of too high a concentration of the metal salt in solution in combination with the acid level.