Chromic anodized aluminum plates of 25 X 100 X 1.6 [mm.sup.3], were used as adherends
. The average of at least three specimens was taken for each blend.
1 Table 2 Physical and Mechanical Properties of Adherend
(AA 2024-T3) Properties Materials AA 2024-T3 E, MPa 71875 V 0.33 [[sigma].sub.t], MPa 481.9 [[epsilon].sub.t] 0.1587
Nirantar, "Increasing strength of single lap joints of metal adherends
by taper minimization," Journal of Adhesion Science and Technology, vol.
As a first step, adherend
surfaces of untreated, acetylated, or heat-treated beech wood are evaluated after they have been either planed, using sharp or dull knives, or sanded.
Tanaka, "A two-dimensional stress analysis of single-lap adhesive joints of dissimilar adherends
subjected to tensile loads," Journal of Adhesion Science and Technology, vol.
This type of failure reflects the proper adherend
surface preparation and joint.
Effects of adherend
deflections in single lap joints, Int J Solids Struct 3: 2565-2587.
In the breaking of an adhesive bond, energy is dissipated by the bond in many ways, inducting deformation and heating of the adherends
, viscoelastic/plastic flow, and heating of the adhesive.
The maximum load was less than 6 kN, and thus there was no plastic deformation for the DC04 adherend
. However, for the lap length of 30 and 40 mm, the maximum load was higher than 7 kN, and the slope of the curves appeared an obvious decrease.
Gecko's toe pad exhibits numerous free-standing and flexible fibrous structures which can penetrate into surface asperities for enhanced splitting contacts with the adherend
. Once the adhesive and the adherend
are in proximity, there are molecular interactions such as the vdW forces involved in the bond, which contribute significantly to the bond strength arising from millions of contact points of nanofibers.
Although mechanical interlocking clearly promotes the bonding strength between two materials, when considering that good adhesion occurs with a smooth adherend
as well, there should be another type of mechanism which strongly affects the bonding.
Residual stresses are present in cured PI films as a result of solvent loss and differences in coefficients of thermal expansion between the film and adherend
. This stress is affected by temperature and humidity and can affect the SAW response.