bare chip

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bare chip

An integrated circuit (IC) that has been cut out from the wafer and is ready for packaging. See die.
References in periodicals archive ?
The model also captures die thickness effects in bare die assemblies, substrate thickness effects in ceramic BGA assemblies, and is validated under a wide range of thermal cycling conditions.
Modular 2-pin ESD test system:Modular Test System for ESD stress and characterization of integrated circuits and structures (in the housing, as bare die, z on the wafer processed in module.
Continental's Bare Die High-Density-Interconnect and Multi-application Unified Sensor Element named PACE Award Winners.
has launched an entire product line of pure- CMOS, single-chip / single-die RF Front-end ICs (RFeICs) in bare die form, enabling its customers to further reduce the size and bill of materials (BOM) cost of wireless products for both the Wi-Fi and Internet of Things (IoT) markets.
All these RFeICs are available in bare die form, making it possible for wireless module manufacturers to design miniature SiP (System-in-Package) or compact, pre-certified ZigBee / ISM modules.
One way of integrating active components is to attach bare die directly on the flex circuit.
13, 2012 /PRNewswire/ -- Micross Components, a leading global provider of specialty electronic components, is pleased to announce that it has received a franchised bare die distribution agreement from Aeroflex / Metelics Hi-Rel Components, a wholly owned subsidiary of Aeroflex Holding Corp.
The DA8620 is shipped in bare die form with gold bumps suitable for mounting as chip-on-flex or chip-on-glass.
Moreover, the MCU can be shipped as bare die only (200-microns thick), making it perfect for applications in smart cards and other small mobile devices that demand long battery life and thin form factors.
The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die.
By replacing the packaged components with bare die, sweeping the passives off the board surface, migrating to fine-pitch connectors and incorporating high-density interconnects, the size, height and weight of the product can be significantly reduced.
22 article, "New Sun Microsystems Chip May Unseat the Circuit Board," the paper described Sun research that would permit bare die to be placed edge-to-edge without the need for traditional PCB or package interconnect.