bare chip

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bare chip

An integrated circuit (IC) that has been cut out from the wafer and is ready for packaging. See die.
References in periodicals archive ?
A processor, for example, may first be imaged when it consists of a bare die bonded to its substrate.
has launched an entire product line of pure- CMOS, single-chip / single-die RF Front-end ICs (RFeICs) in bare die form, enabling its customers to further reduce the size and bill of materials (BOM) cost of wireless products for both the Wi-Fi and Internet of Things (IoT) markets.
All these RFeICs are available in bare die form, making it possible for wireless module manufacturers to design miniature SiP (System-in-Package) or compact, pre-certified ZigBee / ISM modules.
A complicating factor is that current ESD standards do not account for bare die, and in some cases cannot be tested against bare die, especially die with thousands of TSV's.
One way of integrating active components is to attach bare die directly on the flex circuit.
The ZSSC3026 is available in several package options, including PQFN, bumped die and bare die.
Cree (Durham, NC) has released the industry's first fully qualified SiC MOSFET power devices in bare die or chip form for use in power electronics modules.
The DA8620 is shipped in bare die form with gold bumps suitable for mounting as chip-on-flex or chip-on-glass.
Moreover, the MCU can be shipped as bare die only (200-microns thick), making it perfect for applications in smart cards and other small mobile devices that demand long battery life and thin form factors.
The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die.
By replacing the packaged components with bare die, sweeping the passives off the board surface, migrating to fine-pitch connectors and incorporating high-density interconnects, the size, height and weight of the product can be significantly reduced.