is an important class of micromechanical electronics system (MEMS) process [1, 2].
Kal, "Etch characteristics of KOH, TMAH and dual doped TMAH for bulk micromachining
of silicon," Microelectronics Journal, vol.
"In addition, the bulk micromachining
of the silicon, a technology we have migrated from our Advanced Sensors business, greatly improves product delivery dates."
Ten chapters are arranged in sections devoted to lithography (photolithography and next-generation lithographies); pattern transfer with subtractive techniques (dry etching, wet chemical etching and we bulk micromachining
, thermal energy-based removing, and mechanical energy-based removing); pattern transfer with additive techniques (physical and chemical vapor deposition, micromolding techniques, and chemical, photochemical, electrochemical, and thermal energy-based forming techniques).
If material is removed from the substrate, the process is called bulk micromachining
(BMM), and if deposited layers are removed, the process is called surface micromachining (SMM).
2) by bulk micromachining
and using the selective chemical etching techniques (Gardner et al., 2001).
Coverage includes discussion of the electrical, structural, fluidic, transport, and control aspects of MEMS; materials; micromolding; fabrication, characterization, and reliability of single-crystal silicon carbide MEMS; ion etching for bulk micromachining
of silicon carbide; polymer microsystems; optical diagnostics; aerospace applications; packaging of harsh environment MEMS devices; and molecular self-assembly.
Until now, microcalorimeters always have been fabricated using bulk micromachining
techniques where thermal isolation of the detector is achieved by removing the Si substrate from behind the detector, leaving the detector supported by only a thin membrane of silicon nitride.
This article focuses on Si wet bulk micromachining
as applied to low loss planar transmission lines and multi-layer system integration techniques for ICs.
Cronos Integrated Microsystems, a subsidiary of JDS Uniphase in Morrisville, N.C., is betting on a thermally actuated design fabricated by a complex combination of three MEMS processes: bulk micromachining
, surface micromachining, and LIGA.
designates the technique in which the bulk of the silicon substrate is etched away to leave behind desired micromechanical elements.