bump contact

bump contact

[′bəmp ‚kän‚takt]
(electronics)
A large-area contact used for alloying directly to the substrate of a transistor for mounting or interconnecting purposes.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive ?
For further information on Bounce 'n' Bump contact 01484 222087 or e-mail roz.garthwaite@kirklees.gov.uk
Because of the relatively high I/O required to interface multiple die, the interposers commonly adopt a uniform array configured ball or bump contact design.
Although widely used for single die wafer-level chip-scale package (WLCSP) and flip-chip applications, the finer pitch for an alloy ball or bump contact configurations on PoP applications are proving to be very difficult to manufacture.