bump contact

bump contact

[′bəmp ‚kän‚takt]
(electronics)
A large-area contact used for alloying directly to the substrate of a transistor for mounting or interconnecting purposes.
References in periodicals archive ?
For further information on Bounce 'n' Bump contact 01484 222087 or e-mail roz.
Because of the relatively high I/O required to interface multiple die, the interposers commonly adopt a uniform array configured ball or bump contact design.
Ground-bounce and cross-talk are minimized by a die design that provides two (CSPRC030 and CSPRC032) or eight (WLP200) solder bump contacts to the common supply connection.