As semi-conductor devices become more highly integrated, internal stress is produced by the difference of the coefficient of thermal expansion
between the encapsulating material and the chip (silicon).
The coefficient of thermal expansion
is lower in the direction of flow but is higher perpendicular to flow.
The unique composition of glass-reinforced nylon has a coefficient of thermal expansion
that is very close to that of aluminum, drastically reducing internal stresses.
LCP lowered the polyimide melt viscosity enough to allow extrusion at lower temperatures, and it reduced the coefficient of thermal expansion
of extruded film to near zero in the direction of primary orientation.
TM) Unlike standard, prolific LCP materials, QLP's patented Quantech(TM) material technology offers isotopic properties, extremely high temperature stability, and tailor-able Coefficient of Thermal Expansion
(CTE), enabling superior thermal and electrical performance.
A low-stress polyimide to match a circuit-board substrate's low coefficient of thermal expansion
Beryllium was selected for the mirror project over high performance glass because of its superior properties, a low coefficient of thermal expansion
, and its strength-to-weight and stiffness-to-weight ratios.
speed of shrinkage, and coefficient of thermal expansion
of the cured material.
With an exposed pad designed to improve thermal performance, the degree and direction of the Coefficient of Thermal Expansion
(CTE) can be adapted to special heat sink materials, and a variety of semiconductor material technologies, improving the MTTF of the total assembly.
To overcome the thermal limitations of certain piezoelectric materials, Ziptronix' engineered substrate technology combines low-cost piezoelectric materials, such as Lithium Tantalate and Lithium Niobate, with glass, quartz or other materials that offer a low coefficient of thermal expansion
The strong silicon dioxide backbone of Silecs' materials circumvents the integration problems often seen with organic based materials related to coefficient of thermal expansion
(CTE) mismatch with interconnect metals.
The base of the packages can be manufactured from a broad choice of materials from liquid crystal polymers, copper or controlled coefficient of thermal expansion
materials like tungsten/copper, copper/molybdenum, Kovar, etc.