However, the
coefficient of thermal expansion [beta](T) slightly depends on the temperature above the Debye temperature, and this is the reason of nonlinearity of the deformation.
As shown previously in section
Coefficient of Thermal Expansion of RTM6 at the End of the Experiments, the assumption of Eq.
* brick masonry with the tangent modulus of elasticity E = 3.15 GPa, Poisson's ratio v = 0.2, the
coefficient of thermal expansion a = 0.00001, the unit weight [lambda] = 19 kN/[m.sup.3]
HiTcSP3 material features an isotropic
coefficient of thermal expansion (CTE) and thermal conductivity that is 3.6 times that of materials used in state-of-the-art heat sinks.
The isotropic
coefficient of thermal expansion can be adjusted for specific applications by modifying the AISiC's metal to particulate ratio to match the CTE of the die or substrate.
Until recently, optical designers were faced with choosing between using substandard glass or tolerating stresses induced by the
coefficient of thermal expansion (CTE) mismatch between the glasses and metals available.
It enables a tailored
coefficient of thermal expansion (CTE) offering compatibility with various electronic devices and assemblies.
The use of metal core material with a lower
coefficient of thermal expansion than the mold material could alleviate this problem.
Cracks occur due to different
coefficient of thermal expansion of steel 1,1.[10.sup.-5] 1/K and polypropylene 9,5.
The new circuit boards also had enough strength and rigidity to satisfy industrial requirements, and a
coefficient of thermal expansion similar to silicon dioxide and polyimides.
Luedders has gathered technical information on the engineering characteristics of recycled concrete, and says there are some factors that are better with recycled concrete when compared to natural aggregate, such as a lower
coefficient of thermal expansion. He also cites a project he has been following since 1990 that used recycled concrete as concrete aggregate.
This novel approach to studying cyclic deformation of chip-level interconnects depends upon Joule self-heating of the metal and the differences in
coefficient of thermal expansion between film and substrate materials.
