conduction cooling

conduction cooling

[kən′dək·shən ‚kül·iŋ]
(electronics)
Cooling of electronic components by carrying heat from the device through a thermally conducting material to a large piece of metal with cooling fins.
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When the operation temperature is 20 K, the cost of the refrigeration system is about 40% lower than that under the operating temperature of 4.5 K, realizing that the conduction cooling technology would be available in the Tokamak magnet system [14, 15].
In metal chassis format with a baseplate for conduction cooling, the DAx and DBx series can be used with a baseplate operating temperature range of -40 to over 100 degrees Celsius.
The ABC550 and MBC550 Series open-frame power supplies for industrial and medical applications deliver up to 550 W in a compact 3 x 5-inch footprint and can be utilized in many conditions, including convection cooled (no fans) up to 150 W, conduction cooling (heat-sink surface) up to 250 W, or up to 550 W in forced-air-cooled environments.
Conduction cooling or liquid cooling--which has a higher thermal dynamic than air--allows designers to stretch beyond what would be physically possible with air cooling.
Designed to be mounted on a cold plate for conduction cooling, the unit also has an optional shrouded heat sink for forced-air cooling.
The cable load comprises an AIN substrate within an aluminum housing to achieve a good compromise between performance and conduction cooling and the length of the coaxial cable is customized to suit the specific application.
Conduction cooling is the method of using thermally conductive material to transfer heat from the PCB to a cold wall or heat sink.
Whilst passive cooling is still perfectly viable in many applications, this increase in power consumption means that allowances for additional cooling solutions, such as heat spreaders for conduction cooling, must be made.
Similarly, using conduction cooling makes the thermal dissipation system easier and less expensive to achieve.