circuit trace

(redirected from copper trace)

circuit trace

The copper lines (sometimes aluminum) on a printed circuit board (PCB) that allow electricity to flow between electronic components. See wire trace.
Copyright © 1981-2019 by The Computer Language Company Inc. All Rights reserved. THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction is strictly prohibited without permission from the publisher.
Mentioned in ?
References in periodicals archive ?
The aims of the present study was (1) to evaluate the status of selenium, zinc, and copper trace element in patients with chronic heart failure (2), to compare these trace element concentrations in patients with IDCM and ICM subgroups of chronic heart failure, and (3) to investigate potential relation between serum trace element concentrations and the clinical, laboratory and haemodynamic parameters in order to reproduce some findings reported in the literature and to produce new findings.
ed) (lbs/linear inch) 5 to 6 IPC-TM 650 2.4.8 ** Pressed thickness will vary depending on copper trace density and type of copper (0.5 to 2.0 oz.).
Due to the terminals on the bottom side, the maximum line width that can be accommodated for the DC trace is approximately 95 mils, which is sufficient for more than 5 A in a 2 oz copper trace given reasonable ambient temperatures.
Low Df and Dk give designers more freedom to optimize copper trace widths, spacing, and PCB thickness to maintain signal integrity and meet other design constraints such as size and cost.
Typical failure modes include solder joint failure, pad cratering, chip-cracking, copper trace fracture, and underfill fillet failures.
"On a circuit board you have a thin copper trace that leads to a finger-sized conductor," said Steve Gerber, director of human-interface products at Silicon Laboratories.
This is because of the heat-sinking capability of the copper trace. At reasonable currents and temperatures, there is only a minor penalty on trace width attributable to the via.
In an attempt to minimize underfill voiding, the effect of critical substrate features, such as soldermask height, copper trace height and mask/trace separation, have been studied for their effects on underfill voiding for the typical no-flow process.
Or, the chemical plating bath attacks the adhesion between the copper trace and solder mask.
copper trace; and another with 2.0 mm X 2.1 mm X 1.0 mm package will only dissipate 650 mW on the same PCB.