curing temperature

curing temperature

[′kyu̇r·iŋ ‚tem·prə·chər]
(chemistry)
That temperature at which a resin or adhesive is subjected to curing.

curing temperature

The temperature to which an adhesive must be subject in order to ensure that it will cure satisfactorily; usually the time to effect a satisfactory cure (i.e., the curing time) is also specified.
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References in periodicals archive ?
f] is the final conversion obtained following the isothermal cure cycle at a given curing temperature, [[alpha].
Table 6 shows that there is little correlation between the force values observed and the curing temperature.
Decreases in the maximum exothermic peak value and peak shifts to longer times were observed as the isothermal curing temperature was decreased.
These variations are too significant to provide a very consistent process without adjusting the settings of the extrusion line, such as screw speed and curing temperature.
The vitrification occurs when the glass transition temperature (Tg) approaches the curing temperature.
They are referred to as an injection molder's dream, by not being scorchy at 250*F processing temperatures and not retarding at 300*F curing temperature range.
In the experiment, the base line was determined by equilibrating the instrument at a predetermined curing temperature with an empty sample pan, and the heat/time curve was initiated by inserting a pan containing the sample.
The optimum cure time decreases as the curing temperature increases.
The curing temperature was reached in 75 seconds by heating the oven of the rheometer from room temperature.
The adhesion development between the RFL adhesive and rubber compound during cure is a time/temperature phenomenon (activation energy) involving critical scorch time at the curing temperature.
It was found that oxirane ring undergoes nucleophilic attack by the primary amine groups of chitosan and the degree of crosslinking increased with increase in curing time, curing temperature and concentration of chitosan.
This shall be an optimisation between extended pot-life as well as minimisation of curing temperature for a variety of target applications.