dicing


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dicing

[′dīs·iŋ]
(electronics)
Sawing or otherwise machining a semiconductor wafer into small squares, or dice, from which transistors and diodes can be fabricated.
References in periodicals archive ?
The Optium ADS(TM) 160 Dicing System provides superior performance for applications such as wafer split/trim, row slice, dice, and relief cut applications.
NYSE:VSH) announced today that it has completed installation of new dicing, laser trimming, and laser scribing and drilling systems in its Electro-Films Inc.
CORWIL has been one of the leaders in wafer dicing since 1990 and provides IC assembly, wafer dicing and visual inspection services for hundreds of semiconductor companies.
This presents an obstacle to applications such as wafer-level packages and known good die because the traditional package test is no longer available to catch defects caused by the dicing and assembly operations.