face-bonding

face-bonding

[′fās ‚bänd·iŋ]
(electronics)
Method of assembling hybrid microcircuits wherein semiconductor chips are provided with small mounting pads, turned facedown, and bonded directly to the ends of the thin-film conductors on the passive substrate.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.