feature size

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feature size

The size of the elements on a chip, which is used to measure and designate the chip generation at the fabrication level (process technology). Feature size, which today is measured in nanometers, is either the minimum distance between the source and drain on a MOS transistor or half the distance between cells in a dynamic RAM chip (known as "DRAM half pitch"). Certain elements within the transistor may even be smaller than the published feature size for a technology generation. See process technology, MOSFET, dynamic RAM and chip.
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References in periodicals archive ?
With the subtractive processes in use today the features that are defined and plated exhibit very large differences in cross-sectional width from the top of the plated feature to the bottom, in some cases in excess of 20% of the feature width. This is due to the etch characteristics of the processes used to remove the base copper foil in those areas where there is to be no circuitry in the final product.
Comparison of feature width and thickness measurements of Ge pattern for several imaging modalities at two regions within the pattern.
With current feature widths at 100 to 120 [micro]m, this shadow effect has been reduced as much as it can be using existing PV processes.