Further reductions required adoption of various SAP manufacturing processes commonly used in the IC substrate industry, including LDI resists and imaging, improved laser drilling, extremely thin copper foils, via fill pattern plating, and flash etching into a process called MSAP.
There are three main traditional methods for drawing map symbols: (1) using a vector data rendering engine embedded in Internet Explorer (IE); (2) using custom bitmap patterns or icons for point symbols and as a fill pattern for polygons; and (3) using an API provided by HTML5 canvas or a third party, such as ESRI's ArcGIS API for Flex or the Google Maps API.
However, changes in the aluminum and magnesium content of zinc alloys can affect other factors that determine surface finish--die temperature, metal temperature at the end of the cavity fill, fill time, fill pattern and gate speed.
Recent work shows that shifts in measured impedances across a PCB laver are correlated to localized changes in copper density within the fabrication panel due to both the motherboard design and the PCB manufacturer's selection of fill pattern and impedance coupon location.
Other benefits include limited formation of volatiles, which typically cause splay and part surface defects and problems with paint adhesion; decreased flash by avoiding packing at the center of the part more uniform stress distribution; and improved knit line appearance, facilitated by the more uniform fill pattern provided by the SVG system.