flip chip


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flip chip

[′flip ‚chip]
(electronics)
A tiny semiconductor die having terminations all on one side in the form of solder pads or bump contacts; after the surface of the chip has been passivated or otherwise treated, it is flipped over for attaching to a matching substrate. Also known as solder-ball flip chip.

flip chip

A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel/gold. These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter distances than wire, which greatly reduces inductance.


Wire Bond vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps similar to the larger ones that attach BGA packages to the printed circuit board (also shown here). (Image courtesy of Amkor Technology, Inc.)
References in periodicals archive ?
Those applications (using non-melting metal bumps) benefit because the original placement of the flip chip die is now sufficiently precise so self-alignment is not required.
Face-down wired flip chip technologies are covered along with an area array tape-automated bonding type of flip chip.
Without underfill, flip chip (with solder bumps) requires no change in the typical surface-mount process.
While a tremendous amount of research and development effort is being directed at using flip chip bump technology as an interconnect method, there are several process and reliability issues to be addressed before flip chip can be utilized as a mass production interconnect technique across the industry.
The typical large die flip chip package assembly process consists of several steps: 1) flip chip die flux and place, 2) solder bump reflow, 3) underfill and cure, 4) heat spreader/lid attach and cure, 5) BGA ball attach and reflow.
elevate the competitiveness of NFME's flip chip packaging and test technologies
Flip chip process is completed at 370 K; after that, underfill is dispensed between InSb chip and Si ROIC substrate.
It can inspect both flip chip and non-flip chip wafers.
This flip chip, however, was imaged acoustically because it failed reliability testing.
A successor to the TAL 10000, the 20000 "provides a quantum jump" in flip chip assembly technology for RFID inlays.
In flip chip bonding, once mounted, the pattern cannot be inspected using visible light.
Creative Materials, Inc., has introduced two materials designed for flip chip assembly.