flip chip

(redirected from flip chips)

flip chip

[′flip ‚chip]
(electronics)
A tiny semiconductor die having terminations all on one side in the form of solder pads or bump contacts; after the surface of the chip has been passivated or otherwise treated, it is flipped over for attaching to a matching substrate. Also known as solder-ball flip chip.

flip chip

A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel/gold. These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter distances than wire, which greatly reduces inductance.


Wire Bond vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps similar to the larger ones that attach BGA packages to the printed circuit board (also shown here). (Image courtesy of Amkor Technology, Inc.)
References in periodicals archive ?
In flip chips, the very small size of structural defects that can generate sudden field failures makes thorough inspection vital.
Chang, "Characterization of underfill materials for functional solder bumped flip chips on board applications," IEEE Transactions on Components and Packaging Technologies, vol.
Lumex has announced the global launch of its TitanBrite Wireless Bonded LED featuring "flip chips" that are up to 15% brighter than any others in the market.
Fabricators and assemblers of plated bumps or rigid organic substrates designed for flip chips have much to look forward to over the next few years.
Chip placement capability includes 0201s and flip chips, while AC motor and linear encoder combined with vision, ensure a placement accuracy of [+ or -]0.03 mm ([+ or -]0.001").
Flip chips are the same devices as standard integrated circuits, but without the familiar plastic case and metal attachment legs, leaving just the core silicon wafer to be attached to a circuit board.
Using thermosetting materials requires an additional printing step in production to deposit a layer of wet conductive pastes on the circuit before the flip chips can be attached.
Handles SnPb and Pb-free applications consisting of components such as BGAs, CSPs, QFNs, flip chips, and other SMDs.
Fraunhofer scientists used pressure sensors to monitor components (0805s, 0402s, 0201s, QFPs, flip chips and BGAs) on the bottom side of a 240 x 135 x 1.6 mm PCB, with measurements taken at eight different points to examine pressure load on the devices in the Z direction.
This past year saw unprecedented growth in shipments of flip chips. With stronger-than-expected sales of PCs, shipments of CPUs and chipsets with flip chip increased dramatically.
The methods and materials covered within the patent permit attachment of flip chips to electronics assemblies sans underfill adhesive processes.
For flip chips, to determine if yield can be improved and better process control maintained, a comparative analysis of the electromechanical properties is necessary.