heat dissipation


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heat dissipation

[′hēt ‚dis·ə¦pā·shən]
(physics)
References in periodicals archive ?
This technology improves heat dissipation performance 20-fold while ensuring high reliability and long service life.
The product has an adjustable base on which the laptop is placed, which can be lifted to create space for more efficient heat dissipation.
KEY SPECS: installed on a single (rear) side of lighting device substrates, improving heat dissipation
The IPD process can implant a range of alloys atom by atom in the surface of the tool, delivering a spectrum of performance enhancements including higher abrasion and corrosion resistance, oxidation resistance, and improved heat dissipation.
The result is further weight reduction, better heat dissipation, better wear and scuffing resistance and reduced cost.
The new u-LTCOF package is an innovative solution considering both the package technology and the module structure for outstanding heat dissipation.
For reducing the size and increasing the power output of an inverter, it is essential to boost the heat dissipation performance of the power module, which integrates numerous high heat emitting power semiconductors.
However, the heat dissipation using a heat pipe is approaching its effective limit due to the size restrictions of a notebook-shape form.
Using the flip-chip structure, carbon nanotube bumps(3) were run between the electrode (metallic connectors) on the top of the amplifier (the circuitry surface) and the substrate, thereby increasing heat dissipation.
Optimized heat dissipation and special materials of construction are said to prevent adhesion of the needle at the gate.
Heat dissipation by higher-power semiconductor chips presents a major challenge for designers of components for electronic devices.
Lamina Ceramics has introduced a high brightness LED package based on its Low Temperature Co-fired Ceramic on Metal (LTCC-M) technology that addresses the price and heat dissipation concerns of high brightness LED arrays.