heat sink


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Related to heat sink: Heat sink compound

heat sink

(hardware)
/heet sink/ (from "sink", electronics jargon for something which takes in current) A piece of thermally conductive metal attached to a semiconductor or other electronic device and designed to prevent it from overheating by conducting heat away from it and radiating it to the environment. Heat sinks often have fins to increase their surface area. They occasionally have fans attached. Heat sink compound can be smeared between the device and the heat sink to improve thermal conduction.

Heat sink

Where heat is dumped by an air conditioner or by a heat pump used in cooling mode; usually the outdoor air or ground.

heat sink

The medium or environment where heat is discharged after it has been removed from a heat source; usually the atmosphere or a body of water.

heat sink

heat sink
Heat sink.
A piece of heavy metal or a plastic on which electrical components are mounted. Heat generated by these components is transferred to a heat sink by conduction and then dissipated into the surrounding air. A heat sink may have fins to increase its cooling area.

heat sink

A material that absorbs heat. Typically made of aluminum, heat sinks are widely used in amplifiers and other electronic devices that build up heat. Small heat sinks are the most economical method for cooling microprocessors and other chips. They are commonly found glued or clipped to the top or the side of the chip package. See heat pipe, CPU cooler and thermal grease.


Heat Sink on a Chip
This type of heat sink is glued to the top of the chip, typically a CPU chip, which generates considerable heat.
References in periodicals archive ?
In modern industry the efficiency of a heat sink is typically determined using numerical modelling techniques; in relatively rare cases theoretical calculations are used.
The greater the force applied between the heat sink and the device, the lower the thermal resistance.
Caption: Software runs simulations and comes up with complex designs for heat sinks that can boost cooling by 30%.
The grid Independency checked for average transfer coefficient of the heat sink, have for different number of grids in VSPCPFHS and VSPSPHFS for different L/D ratios.
Moreover, the heat sink placed at the outer side of PCD must be bigger than inner sink to reduce temperature.
This is appropriate for heat sink design, where one has knowledge of these temperatures ([T.sub.bot] and [T.sub.amb]) a priori and is not concerned with the temperature profile in the air flow; however, it is different than the temperature scale used in considering the flow of the air in the impeller (for example, in an effectiveness-NTU analysis), which is the log-mean temperature difference.
The simplified heat sink model was designed without thermal interface material (TMI), because it introduces an error of approximately 1[degrees]C at 5,031 W power losses (value obtained from modelling results); therefore we chose to neglect the absence of TMI.
By manufacturing HB LED heat sinks with ThermaTech solutions instead of aluminum, Mars Otomotiv reduced part weight by more than 30%.
Figure 3 shows the external quantum efficiency (EQE, (light output power/h])/(injection current/e), where h is the Planck constant, ] is frequency, and e is the elementary charge) of the DLC-FCLED and non-DLC-FCLED as a function of the heat sink temperature at injection currents of 350, 700, and 1,000 mA.
"The idea was to see if a heat sink could eliminate the need for a fan, thus removing the potential for vibration and the need for a battery," explains Jim.
Each heat sink comes with a pair of durable plastic or brass push.
Researcher Jeff Koplow has designed this heat sink, which is the fan in itself.