heat slug

heat slug

(hardware, processor)
A metal plate that helps dissipate heat away from the silicon core of a processor to the packaging or heat-sink.
References in periodicals archive ?
In this paper, a simulation work is presented where the heat dissipation of single chip high power LED attached to copper diamond based cylindrical heat slug was scrutinized.
Optional accessories such as the HP-97[TM] heat slug and WTC-100[TM] wind tunnel controller are available for maximizing the full capability of the CWT-100[TM].
Yamaichi's Open Top Socket Series 1C357 features a reliable double lead foot contact, and a variety of ground pin and heat slug options is available.
viscosity; perimeter-fill processing; flow-around a center heat slug or adhesive dots; damming, mixing and sequencing, etc; or they could involve processing details: dispense nozzles and pressures; access, interference and traverse patterns; studies of damage to columns; remove and repair-replace processes; displacement of the part or spacers due to side filling, etc.
The package of the D306A is a narrow-body SOIC-16 with a heat slug, making it suited to automotive instrument cluster and signage applications.
"The ITRI heat slug technology is one of the building blocks in STATS' long term plan towards providing customers with a total solution to all their backend semiconductor requirements," explains Han.
The footprints were originally created for a package with four 1.27mm (0.05") pitch leads on one side and a big heat slug on the other.
The thermal conduction path in a packaged LED are influenced by several factors such as heat slug size, slug material, type of thermal interface material and heat
Each part comes in an eight-lead SOIC (with heat slug) package.
The device is packaged in a small footprint, 10mm x 10mm, 52 EdQuad, TQFP package, with exposed heat slug for optimized cooling.
The LED package under scrutiny consisted of GaN chip attached to a copper based cylindrical heat slug
This work focuses on the evaluation of the junction temperature and LED chip stress with varied copper rectangular heat slug size under natural convection condition, h= 5 W/m2C.