hot-pressing

hot-pressing

The pressure forming, between heated platens, of plywood, laminates, particle-board, fiberboard, etc.; usually requires thermosetting resins and heat for curing.
References in periodicals archive ?
The hot-pressing process is a vital step in the manufacture of wood-based composites and directly affects the properties and quality of the final products.
In the MDF hot-pressing process many physical processes are involved and the complexity of this operation arises from the fact that they are coupled.
Four factors were studied in the experiment, resin content, hot-pressing temperature, hot-pressing time and the mass ratio of waste wood and paper, and four levels of each factor were selected out through a L16 (45) orthogonal experiment(Table 1).
More studies are necessary to obtain the evidence and data revealing the effect of hot-pressing temperature on the board properties.
Internal steam pressure produced during the hot-pressing cycle in particleboard production is critical to the newly developed bond strength that will determine the overall performance of particleboard.
Earlier studies of the in-situ formation of the vertical density profile (VDP) during oriented strandboard (OSB) hot- pressing have shown significant density changes between the different thickness layers within a panel occurring well into the hot-pressing cycle.
The effects of hot-pressing and resin-curing on individual strand properties were investigated in this study.
Development of a fundamental understanding of heat transfer and resin curing during hot-pressing will help to optimize the manufacturing process of medium density fiberboard (MDF) allowing increased productivity, improved product quality, and enhanced durability.
Due to increased temperature within the mat, microwave preheating can significantly reduce hot-pressing time and increase production efficiency.
The shape of the VDP depends on heat transfer and moisture re-distribution during hot-pressing, which in turn depends on press closing rate, wood initial moisture content, and the proximity to the end grain.
The effects of hot-pressing and resin application on tensile modulus, strength, and dimensional expansions (in three directions) were discussed.
Three types of adhesives, urea-formaldehyde (UF) resin, phenol-formaldehyde (PF) resin, and polymeric methylene bis(phenylisocyanate) (pMDI) were used to bond particleboard during the investigation of the effect of hot-pressing variables on volatile organic compound (VOC) emissions.