intergranular


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intergranular

[¦in·tər′gran·yə·lər]
(science and technology)
Occurring between grains.
References in periodicals archive ?
This lesson was learned during the development of interstitial free steels where intergranular fracture was characteristic of cold work embrittlement.
Esta muestra, seleccionada de los clastos colectados en el paquete P-02, es hipocristalina, con fenocristales (39 vol.%) de 1 mm a 6 mm y masa fundamental (57 vol.%) con cristales de tamanos menores a 0,7 mm, La textura general es inequigranular seriada y texturas especificas intergranular y vesicular.
Uhlig [4] have more or less classified the corrosion types as: (1) General Corrosion or Uniform Attack, (2) Pitting, Fretting, Cavitation-erosion, (3) Dealloying Dezincification and Parting, (4) Intergranular corrosion, (5) Cracking.
Iron oxide staining is common in the intergranular space between dolomite rhombs (Figs.
As a result, the intergranular sliding of the spherical [beta]-Al particles occurs.
Intergranular cracks are developed through cavity formation at the grain boundaries due to high local stress concentration caused by grain boundary sliding.
This is due to the increase of the intergranular distance between MSG grains and the decrease of the volume concentration of the solid.
Considering the good physiomechanical properties of the TaC and the ZrC compound, the intergranular composition of the TaC ceramics may suggest a new type of nano-(Ta, Zr)C ceramic of good electrical and thermal conductivities.
The particles in the pore fluid are mixed with oil and concentrated locally to form the remaining oil of intergranular adsorbing state (Figure 7(c)).
Because metal Cu is immiscible in the CrN phase, combined with XRD and XPS results, it can be concluded that the Cu as metallic species distributed in the interstitial of nanocrystalline CrN phase or segregated as amorphous phase in the intergranular boundaries with Cu content below 15.16 ([+ or -] 0.23) at.%, then Cu atoms grew up into metallic Cu crystallites agglomerated in the intergranular boundaries when Cu content was higher than 19.35 ([+ or -] 0.14) at.%.
Transgranular failure mechanism have changed into the intergranular and there are visible ductile failure traces' dimples.

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