interposer


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interposer

An electrical interface between connectors. An interposer often connects contacts of different sizes together. For several examples, see BGA.
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References in periodicals archive ?
New developments in high-density packaging were discussed as alternatives to silicon interposers. TSMC discussed its high-density large package using a six-layer redistribution layer (RDL) interposer to connect four silicon chiplets and two HBMs.
He said the company has demonstrated integrated capacitors on an interposer, thermal interface materials, and micro-bumps.
A number of presentations focused on the potential for glass interposers, but whether the "glass" is half-full or half-empty was not clearly answered.
The spring protrudes from the interposer set bottom, while the probe protrudes from the top.
The probe station of this system uses a sandwich-like holder with a hole in the center of its top and bottom plates, as shown in Figure 6(b), to grip the silicon interposer under testing.
Next-generation high density semiconductor packaging is a promising solution for smaller and higher-function mobile devices, and the key to realize such advanced technology is interposer technologies that interconnect the Si chip and the printed circuit board.
An interposer connects silicon memory chips and printed-circuit boards with electrodes.
Xilinx SSI technology utilizes microbumps fabricated on the 28nm FPGA die to interface to a silicon interposer built using low-risk, high-yield 65nm technology.
RedHawk-3DX provides a 3D-IC extension to support both concurrent and model-based multidie simulations of designs with silicon interposer and through-silicon vias (TSVs).
Singapore, Dec 6, 2011 - (JCN Newswire) - The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology.
One near-term way to mimic this system would be to direct cool liquid from manifolds into microchannels machined or etched into the interposers. This solution overcomes edge-cooling limitations, but remains constrained by the resistance to thermal conduction between the chip and the solid body of the interposer.
Agilent Technologies and Nexus Technology have made available their DDR3-1867 DIMM and DDR3-1600 SODIMM slot interposer test solutions.