lead frame


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lead frame

A common type of chip package that uses metal leads that extend outside the housing. Lead frame technology goes back to the early days of DIP chips, but is still widely used in many package varieties. See chip package.


Lead Frame Packages
These cross sections show the differences between lead frame chip packages in both standard and CSP varieties. (Illustration courtesy of Joseph Fjelstad.)
References in periodicals archive ?
However, as surface plasmonresonance technology is still not widely accepted in the lead frame industries, this technology is under consideration of the current work.
The integrated lead frame activates the horn when the driver presses the airbag cover in the centre of the steering wheel, completing an electric circuit.
Stacked ceramic capacitors with temperature ratings of 200[degrees]C not only satisfy those application demands, but also provide high capacitance values and, due to the performance benefits imparted by the lead frames, generally provide low parasitic inductance, making them ideally suited for decoupling applications in gamma ray logging tools.
said a company integrating their lead frame businesses, SH Materials Co., will begin operations July 1 to manufacture the material for semiconductors.
High reliability and LED lifetime are further enabled through its excellent adhesion to silicones and epoxy encapsulates as well as the metallic lead frame, avoiding chip degradation due to moisture or air diffusion through interfacial delamination phenomena.
Some specific topics include a mass transfer model for coated urea particles in a controlling-release process, simulation analysis of springback for lead frame copper alloy, and the effects of nanofiber diameter on filtration efficiency.
The lack of a wettable surface is due to the package separation process, leaving exposed base material on the exposed edges of the lead frame or smearing resin on the plated surfaces.
With advancements in the electronics industry particularly in the East China region, to where HCSZ's products are mainly supplied, demand for photosensitive dry films for use in substrates in semiconductor packages, direct imaging system, lead frame, and etc., is increasing, and further market expansion is expected.
The first member of the new series has a metal lead frame, a compact package, and a tried-and-tested lens design.
Prior to the introduction of the Flip-Chip Wireless Front-End Integrated Circuit (FEIC) from Epic Communications, Inc., Taiwan, radio frequency (RF) chips for smart phones and mobile Internet devices had lead frame and laminate packaged front-end modules (FEM), which used multiple discrete chips and bond wires within.
Industry executives estimate the LED lead frame production, which now accounts for around 7% of the company's electronics sales, to help float the company's consolidated revenue above NT$9.5 billion (US$296 million) this year.
Enables prototyping of lead frame, other featured sheet parts or steel tubes.