micromachining

micromachining

[′mī·krō·mə‚shēn·iŋ]
(engineering)
The use of standard semiconductor process technologies in combination with specially developed processes to fabricate miniature mechanical devices and components on silicon and other materials.
References in periodicals archive ?
The EWE Downsize is the vanguard for future developments in the field of micromachining, demonstrating the strength of BIG KAISERs in-house development capabilities in both analog and digital solutions, comments Jos Fenollosa, Head of Research and Development at Big Kaiser.
Its motorisation contributes to considerably reduced set-up times and higher repetition accuracy for a wide variety of laser material processing, display, micromachining, solar and battery applications.
Key manufacturing processes of the company include thin-film sputtering, laser ablation, and precision laser micromachining.
Optoscribe's 3D glass-based photonic integrated circuits combine embedded waveguides and high precision micromachining for applications ranging from data center optical transceiver interconnects, to fiber connectivity and consumer electronics.
The hexapod has uses in photonics, laser processing, optical inspection, semiconductor, micromachining, metrology, and medical applications.
Laser Light Technologies is a contract manufacturing, laser systems integration, and engineering consulting firm that specializes in laser micromachining services.
Applications include semiconductor manufacturing, metrology, and micromachining.
Their topics include the design optimization of a wind turbine using artificial intelligence, the reliability analysis of engineering systems: an accelerated life testing for boiler tubes, the electrical impedance modeling of the electrochemical spark micromachining process, the development of a material constitutive model and simulation technique to predict nonlinearities in piezoelectric materials under weak electric fields, and a stochastic approach to uncertainty control in multiphysics systems: modeling carbon balance and analyzing greenhouse gas emissions using satellite tools.
TOKYO, Nov 8, 2016 - (JCN Newswire) - Mitsubishi Heavy Industries Machine Tool, Co., Ltd., today unveiled the "ABLASER-DUV", the latest model in the ABLASER micromachining line.
It is best suited for research and industrial applications such as: fiber alignment, metrology, quality assurance testing, photonics packaging, test equipment and micromachining. The compact closed-loop positioning stage can handle payloads up to 11 lb, with velocity to 20 mm/sec.
Mitsubishi Heavy Industries Machine Tool Company's first "Ablaser" laser micromachining system has been delivered to a leading Japanese manufacturer of precision instruments, Mitsubishi announced.
Like the RBX12 produced by BIG Daishowa Seiki, an air-powered spindle for micromachining applications that provides a variable rotational speed between 100,000 and 120,000 rpm.