multilayer board

multilayer board

[‚məl·tē‚lā·ər ′bȯrd]
(electronics)
A printed wiring board that contains circuitry on internal layers throughout the cross section of the board as well as on the external layers.
References in periodicals archive ?
The lever at the right was used to "pump up" the press and create the pressure needed to laminate the inner-layers, prepreg and foil into a multilayer board.
This automated approach helps reduce variations in web fibre orientation profiles, which can cause a range of imperfections in paper and board products such as stack-lean or paper jams in sheet-fed devices, misregister in colour printing, twist in multilayer board, and weakened corrugated containerboard.
A multilayer board may have a high thermal demand and 1 m/min could be too fast.
Rigid multilayer board sales rose 1.1% over last year, but fell 7.8% from April.
In addition, this material was the first in the market that allowed designers to build multilayer board (MLB) constructions (not just stripline) and match it with FR4 to create boards that covered the full range of frequencies needed in military and high reliability applications.
APPLICATION: Simulator helped to understand grade change dynamics in a multilayer board machine, and to re-tune the automatic grade change program.
Trayforma Special is multilayer board reinforced with CTMP (chemi-thermomechanical pulp) in the middle layer to add rigidity.
Trayforma incorporates all tray-formed packages; the Trayforma Special is multilayer board reinforced with CTMP in the middle layer to bring added rigidity and is suitable for various frozen and chilled food packages.
For a multilayer board, copper will be on both sides of the substrate, which forms the innermost or central layer.
Conventionally, panel plating (FIGURE 2) has been widely used to connect the circuits on a double-sided or multilayer board. Panel plating consists of 1) drilling holes in the insulating film, 2) adding two types of conductive copper plating, and 3) forming a circuit.
A comparative simplified modal analysis was done between a traditional multilayer board and equivalent TWI assembly.

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