By integrating design, raw materials and production expertise, NIC has established itself as a leader in passive component
Exhibiting in booth 411, Vishay will highlight its latest industry-leading power IC, passive component
, diode, and MOSFET technologies for a wide range of applications.
The silicon photonics PDK includes design guide, design rule check deck, technology files, active and passive component
documentation, abstracts, schematics and compact models for the development of PICs.
International Resource News-January 12, 2012--Suntron Corporation develops 01005 passive component
manufacturing process(C)1994-2012 ENPublishing - http://www.enpublishing.co.uk
The result of this enhancement in performance is better dynamic range in passive component
testing and better level stability in active device testing.
The papers here cover packaging and embedded components, including an invited paper on the influence of full-filled polymer molding on high-frequency circuits, system-in package, including papers on a breakthrough in miniaturization and nano-integration supported by very high quality passives and system level design tools, process and material requirements for successful heterogeneous passive component
integration in RF systems and through wafer interconnects in a technology that goes beyond medical applications.
* Maintain an awareness of emerging embedded passive component
Leading passive component
makers are: AMP/Tyco International, Molex, and Vishnay Intertechnology of the United States; EPCOS of Germany and Framatome of France; Kyocera, Murata, and TDK of Japan.
With a capability to measure IL and RL in a single sweep up to 1000 nm/s, it is designed to meet the needs of passive component
manufacturers, who are looking for effective testing solutions to reduce testing time without sacrificing accuracy and reliability.
Among the topics of invited papers are process and material requirements for the successful heterogonous passive component
integration in radio-frequency systems, smart lead-free solders through shape-memory alloy reinforcement, and compression creep behavior of the 95.5Sn-Ag-Cu solders.
The A7 combines the production-oriented capability of rapidly adjusting a source within a certain tolerance using the panel meter, along with metrology capability of a full time domain analysis of a source or passive component
through data acquisition from the frequency center.