polyimide resin

[¦päl·ē′i‚mīd ‚rez·ən]

(organic chemistry)

An aromatic polyimide made by reacting pyromellitic dianhydride with an aromatic diamine; has high resistance to thermal stresses; used to make components of internal combustion engines.

Mentioned in ?

Fiber Glass Reinforced Plastic

References in periodicals archive ?

To obtain low Dk, a low Dk matrix polyimide resin (Dk of 2.6) was designed to decrease Dk as much as possible.

Thermal Interface Materials

Teijin is targeting annual sales in this field in excess of 900 m by around 2030.??Renegade offers specialized knowhow in highly heat-resistant resins and provides unique thermal-cycle resistant prepregs incorporating highly heat-resistant polyimide resin made from low-toxicity raw materials.??Teijin Group (TOKYO:3401) is a technology driven global group offering advanced solutions in the areas of environmental value; safety, security and disaster mitigation; and demographic change and increased health consciousness.

Teijin to acquire Renegade to expand carbon fiber business for aerospace applications

Renegade offers specialised knowhow in highly heat-resistant resins and provides unique thermal-cycle resistant prepregs incorporating highly heat-resistant polyimide resin made from low-toxicity raw materials.

Teijin to Acquire Renegade to Expand Carbon Fiber Material Operations for Aerospace Industry

Substrate Flexible Film: Polyimide, PET, LCP, PEN, PEEK Others: Paper, cloth, metal foil, hybrid material Conductor Silver powder, copper powder, carbon powder Metal coated plastic Nano particulate powder Insulation Epoxy resin, acrylic resin, polyester resin, polyimide resin Functional Piezo electric materials Optical Organic electroluminescence materials, transparent resins Interconnection Anisotropic conductive paste, ACF Active material Semiconductor paste Shielding Silver paste, carbon paste TABLE 2.

Screen printing for high-density flexible electronics: new paste materials and advances in screen-printing equipment create a flexible opportunity

Japanese chemical company "Foray developed a new photosensitive polyimide resin with a curing temperature below 200[degrees]C for use in semiconductor device protection.

Japanese PCB production in 2006: retooling for higher margin product lines keep many Japanese companies profitable in 2006

Large number of studies about DA concerns the results of the research of the cure process of epoxide and polyimide resin system, including modification with polysiloxanes.

Monitoring of curing process of siloxane resin by dielectric analysis

Polyimide resin is highly heat resistant and has a low dielectric constant, allowing the FPC to achieve improved reliability and reduced transmission losses.

Fujikura develops multi-layer FPC

Richard Van Ryper, senior development engineer at the company's engineered polymers division, suggested that the transfer case manufacturer try washers made from Vespel, DuPont's polyimide resin. The New Process Gear division had used Vespel washers successfully in other transfer case applications.