reactive ion etching


Also found in: Acronyms.

reactive ion etching

[rē′ak·tiv ′ī‚än ‚ech·iŋ]
(electronics)
A directed chemical etching process used in integrated circuit fabrication in which chemically active ions are accelerated along electric field lines to meet a substrate perpendicular to its surface.
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18 Global reactive ion etching technology market, 2012 - 2019, (USD Billion) FIG.
The device for the determination of specific area of nanomaterials (BET) , (Deep Reactive Ion Etching (DRIE) with the ability to create micrometric and nanomteric structures in vertical and deep forms was presented, while capillary electrophoresis instrument with the ability to quantitatively and qualitatively identify drugs and animal spectroscopy device (HiReSPECT) with the ability to take images from small animals were introduced in Iran Nano 2011 Exhibition.
This market covers the following equipment types: Focused Ion Beam, Broad Ion Milling, Secondary Ion Mass Spectrometry, Energy Dispersive X-Ray Spectroscopy, Reactive Ion Etching, Ion Milling, Chemical Mechanical Planarization and related equipment markets for Electron and Scanning Probe Microscopy.
Vacuum system for reactive ion etching of silicon, silicon oxide and deposition of carbon layers;
SPTS Technologies, a supplier of advanced wafer processing solutions, and imec, a world-leading nanoelectronics research center have announced a joint partnership to further advance micro- and nanosized components for BioMEMS, using SPTS' Rapier silicon deep reactive ion etching (Si DRIE) technology.
The article, "Nanofabrication of Sharp Diamond Tips by E-beam Lithography and Inductively Coupled Plasma Reactive Ion Etching," describes the etch recipe developed while creating sharp diamond tips for atomic force microscopy (AFM) probes.
This commercial order for the Tegal ProNova reactor is from a first-time Tegal customer in the EU, who will use the Deep Reactive Ion Etching (DRIE) tool to perform innovative research for high-performance microelectronics on 200mm wafers.
This reactor is called a reactive ion etching (RIE) to be used for the etching of layers of oxides, nitrides and semiconductor on planar substrates, with diameters between 10 and 200 mm (8 inches).
Since 2002, Kyocera has offered high-performance solar cells to the global market that utilize a unique Reactive Ion Etching (RIE) technology.
The Inductively Coupled Plasma (ICP) etch tools will be used for a wide range of applications including deep reactive ion etching (DRIE) of silicon, plus dielectric, compound semiconductor and metal etching.
The move completes the transition associated with Tegal's acquisition of the Deep Reactive Ion Etching (DRIE) products and related intellectual property for 3D packaging and MEMS devices from France-based Alcatel Micro Machining Systems (AMMS) and Alcatel Lucent.
This residue is left over from the passivation step of the deep reactive ion etching (DRIE) process that s used to make TSVs.

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