5Cu (SAC 305) and the board was reflowed
in convection oven with air atmosphere using a typical lead-free reflow profile.
No significant differences between SnCuNi and SAC alloy when reflowed
under the same conditions.
in air showed a decrease in solder penetration.
The thickness of Cu6Sn5 IMC increased with increase in reflow time up to a time of 300s, and the thickness decreased for samples reflowed
Abstract: This paper reports the results from percentage-fill measurements of intrusively reflowed
Pb-free solder joints, where the same Pb-free alloy has been applied to boards with different finishes.
The test boards had an organic solder preservative (OSP) finish and were reflowed
in an air atmosphere.
Higher [DELTA]t assembly designs can be reflowed
in air at up to 260[degrees]C.
When the topside is profiled and the bottom side is already profiled, more heat is required so that components on the topside are properly reflowed
and to make certain that the desired soldering temperature is achieved for that side of the board.
Several factors can help mitigate the risk of tin whisker growth, such as the use of matte tin, tin alloy, nickel barrier layer and reflowed
In simple terms, a sample of paste is printed on a non-solderable surface--in this case, a ceramic tile--and reflowed
The samples reflowed
in the inert (low oxygen/nitrogen) atmosphere gave improved wetting, which was shown by a circumferential tinning layer around each deposit.
Q: What is the cause of parallel ripples or lines on the surface of reflowed