selective plating

selective plating

[si′lek·tiv ′plād·iŋ]
(metallurgy)
An electrochemical process in which the base metal is masked, except the area to receive the plate, with a nonconductive material; the masked metal, with an electric current running through it, is then sprayed with a solution of plating metal which adheres only to the unmasked section.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive ?
The answer came in the form of selective plating. The SIFCO Process[R] of selective plating, is a portable electroplating method used to enhance, repair, and refurbish localized areas on manufactured components without the use of an immersion tank.
Post-process operations like overmolding, selective plating, and printing are easily accomplished.
Other key features include: Caliber: .300 Wby Mag; "NHSRA Scholarship Rifle 2014" engraved on the barrel and NHSRA logo engraved on the floorplate; NHSRA logo embossed on the strap of the rifle's walnut-tone leather case; low-luster blue metal finish and engraved 24-karat gold and silver selective plating; exhibition-grade claro walnut stock with ebony tip, cap and gold swivels, stock has a satin oil finish and checkering in a fineline point pattern; brown sidewall recoil pad; 26-inch No.
The target develops, manufactures and sells selective plating products and provides contract services for low volume repair, refurbishment and original equipment manufacturer applications.
In the near future, companies will have the option of accessing INCERTEC's reel to reel plating, selective plating and barrel/rack plating for gold.
office in Tualatin, Ore.), allows circuitry to be "drawn" on a part with a laser beam, which activates a special additive that allows for selective plating of metal onto the lines of circuitry.
Methods: Selective plating on polymixin-pyruvate-egg yolkomannitol-bromocresoi purple agar (PEMPA) was used for isolation of B.
It was used as selective plating resists, as well as solder resists.
At the next lower level, ENIG is an option for both soldering and wire bonding without selective plating on the wire bonding sites.
For selective plating, presumptive Salmonella colonies from selective plates were confirmed with the API 20E identification system (BioMerieux).
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