solder ball


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solder ball

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA.
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References in periodicals archive ?
Several previous studies have focused on securing the mechanical safety of a solder joint under vibration excitation by applying mitigation techniques to the package, such as applying an underfill or dummy solder balls [6-8].
Firstly, the tin ball was transferred from the solder ball feeder to the welding tip, and then, the tin ball was blown to the end of the welding tip under [N.sub.2] flow.
"It is inevitable that solder ball metallurgies will change as industry learns more about the performance of lead-flee technologies," said Jim McElroy, CEO of iNEMI.
A void within a solder ball, for example, should be imaged with sufficient contrast to permit software algorithms to consistently distinguish the void from the surrounding solder.
Current BGA procedures start with the application of a patterned flux layer to devices loaded in a platen, followed by precise positioning of small solder balls on the appropriate terminal pads.
* The electrical path of the Giga-snaP BGA socket adapters is a high priority performance issue with the physical length from the top connection point on the male adapter to the solder ball on the female socket of 3 mm.
According to the company, the series is also the only product in the mil/aero market to feature 04 solder ball terminations, which enable minimal interconnect inductance and are the perfect complement to flip-chip packaging technology.
The PBGA cross sectional view of FIGURE 1c illustrates that signal path from die pad to the solder ball can contain wire bond, package traces and via(s).
Die attach, lead bonding, encapsulation, solder ball and test units are off the shelf from multiple suppliers, requiring only unique motion-control software and parts fixturing.
More documentation slump, solder ball, wetting and spread test analysis will be included in the next technical paper on this topic.
Abstract: Solder ball attach of two water-soluble solder pastes, a novel zero halogen material and a halogenated material, was compared in nitrogen and air atmospheres after reflow in a Malcom reflow simulator.