solder bumping


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solder bumping

A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip.
References in periodicals archive ?
C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and WLCSP"
Solder bumping onto a socket is performed by printing paste or pin-transfer flux onto the pin head, followed by solder ball placement and reflow.
Unitive services include multi-level passivation and thin film wiring, solder bumping and chip scale packaging.
The solder bumping process is accomplished in a foundry-like processing facility.
The CHAD LED wafer handling solutions can be applied to process tools at different stages of manufacture and for different types of manufacture - including metrology inspection and measurement, stud bumping, and solder bumping.
Wafer-level solder bumping was used to prepare ICs for flip-chip attach (FCA) to a multi-chip module (MCM).
one of the world's largest semiconductor packaging and testing companies, has completed the development of its 300mm wafer solder bumping technology.
There is no need for expensive evaporation equipment or mask aligners as required for many solder bumping techniques, and the bumps are formed in one step as opposed to deposition of several layers of metal.
Among the various methods of solder bumping processes, electro-deposition is increasingly becoming the preferred method, especially for fine-pitch applications.
The ABA process decreases the size of Nextreme's thermal bumps to approximately 125 microns, which makes them flip-chip bumping compatible with standard solder bumping processes commonly used in electronics packaging.
IBM's Peter Gruber has conceived a new solder bumping method that builds on the controlled collapse chip connect invention yet eliminates several steps--including all mold cleaning.
The inherent cost advantages, flexibility, and ease of use make SUSS production lithography systems extremely attractive solutions for different wafer level packaging technologies, including solder bumping, gold bumping, redistribution layers (for wafer level packages and chip stacking) or re-passivation.