solder bumping


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solder bumping

A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip.
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References in periodicals archive ?
Advanced Packaging, focused on back-end semi packaging, covers IC packaging processes, including 3D integration wafer dicing, die placement, die attach, wire bonding, encapsulation/molding, lead forming, solder bumping, package inspection, package test, l aser marking, singulation, packing and shipping.
Solder bumping capacity now makes up about 5% of the world market.
Solder bumping onto a socket is performed by printing paste or pin-transfer flux onto the pin head, followed by solder ball placement and reflow.
Unitive services include multi-level passivation and thin film wiring, solder bumping and chip scale packaging.
The solder bumping process is accomplished in a foundry-like processing facility.
Solder bumping with a solder paste is another BGA assembly technique being considered by the packaging industry.
Other methods, including tin-lead and lead-free solder bumping, are less significant in terms of popularity, Yole said in a June 16 webinar.
"C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and WLCSP"
Advanced Semiconductor Engineering, Inc, (NYSE:ASX), Santa Clara, Calif., one of the world's largest semiconductor packaging and testing companies, has completed the development of its 300mm wafer solder bumping technology.
There is no need for expensive evaporation equipment or mask aligners as required for many solder bumping techniques, and the bumps are formed in one step as opposed to deposition of several layers of metal.