Advanced Packaging, focused on back-end semi packaging, covers IC packaging processes, including 3D integration wafer dicing, die placement, die attach, wire bonding, encapsulation/molding, lead forming, solder bumping
, package inspection, package test, l aser marking, singulation, packing and shipping.
capacity now makes up about 5% of the world market.
onto a socket is performed by printing paste or pin-transfer flux onto the pin head, followed by solder ball placement and reflow.
Unitive services include multi-level passivation and thin film wiring, solder bumping
and chip scale packaging.
The solder bumping
process is accomplished in a foundry-like processing facility.
with a solder paste is another BGA assembly technique being considered by the packaging industry.
Other methods, including tin-lead and lead-free solder bumping
, are less significant in terms of popularity, Yole said in a June 16 webinar.
"C4NP: Lead-Free and Low Cost Solder Bumping
Technology for Flip Chip and WLCSP"
Advanced Semiconductor Engineering, Inc, (NYSE:ASX), Santa Clara, Calif., one of the world's largest semiconductor packaging and testing companies, has completed the development of its 300mm wafer solder bumping
There is no need for expensive evaporation equipment or mask aligners as required for many solder bumping
techniques, and the bumps are formed in one step as opposed to deposition of several layers of metal.