We used fully CMOS compatible surface micromachining
technology approach to fabricate prototype IDT CMUTs.
has been viewed as more cost-effective whereas bulk micromachining was often chosen for higher sensitivity and precision.
Howe, "A review of the chemical reaction mechanism and kinetics for hydrofluoric acid etching of silicon dioxide for surface micromachining
applications," Thin Solid Films, vol.
is so named because the process takes place on the surface of the wafer, where films are used for structural elements and deposited using a technique such as low temperature chemical vapor deposition (LPCVD) [3, 4].
This capacitor can be easily built using surface micromachining
in CPW center microstrip conductor by having two plates facing each other separated by an air-gap.
The mechanical surface micromachining
technique presented here will be capable of machining a wider range of materials which can benefit from superhydrophobicity.
So in short, the trends in MEMS processing are integration with CMOS, from bulk to surface micromachining
and, as always, the smaller the better!
The fabrication process begins with steps similar to those used in polysilicon surface micromachining
, then continues with the conformal deposition of 1000 [Angstrom] of high temperature oxide (HTO) along the tops and sidewalls of the patterned polysilicon structures to serve as a sacrificial layer that defines the eventual electrode-to-structure capacitive gap spacing.
In surface micromachining
, detectors are fabricated on a silicon nitride membrane "table" supported by legs on top of a solid substrate.
Recent advances in surface micromachining
. Technical digest, The 13th Sensor Symposium, p.
The current experimental setup contains a 3 mm by 3 mm array of 1,024 (32 x32) cantilevers, which are created by silicon surface micromachining
. A sophisticated design ensures accurate leveling of the tip array with respect to the storage medium and dampens vibrations and external impulses.
technology has made many significant advances recently, but release and in-use stiction remain a key problem.