system in package
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system in packageA complete system packaged in one housing. A system in package (SiP) contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate. A SiP is really a multichip module (MCM) that contains all the parts of a complete system. The SiP term was first used by Amkor Technology in the late 1990s and not trademarked in order to encourage its use worldwide. See SoC and MCM.
|System In Package|
|This cross section of a SiP shows a microprocessor (µP), SRAM and flash memory chips packaged together in the same housing. The L,R,C stands for inductor, resistor, capacitor. (Image courtesy of Amkor Technology, Inc.)|