thermal capacitance

thermal capacitance

[′thər·məl kə′pas·əd·əns]
(thermodynamics)
The ratio of the entropy added to a body to the resulting rise in temperature.
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References in periodicals archive ?
Antonopoulos and Koronaki (1998) investigated the concept of effective thermal capacitance, a useful concept for simplified modeling.
7) Second, the system has a high thermal capacitance, so control sequences should avoid any requirements for rapid modulation.
As a consequence, when computer simulations of GCHP systems with a short time step are carried out, a suitable model of the borehole thermal capacitance is necessary because it affects the heat carrier fluid temperature and, consequently, the consistent detailed prediction of the thermal behavior of the borehole field.
It is often possible to work with less of a temperature difference depending on the thermal capacitance of the building materials.
R/(Pi x C)) R = Effective thermal resistance of chip in [degrees]C/W C = Effective thermal capacitance of chip in J/[degrees]C
There, on a very difficult site next to one of the main railway lines from London to Scotland, quite ordinary and easily available materials such as sand bags, straw bales, solar collectors and corrugated polycarbonate sheet were bravely used to make an experimental building with unusual thermal capacitance and receptivity to ambient energy.
diss] is a clear sign that the thermal capacitance is also a function of dissipated power.
2011) demonstrated progress toward experimentally determining the thermal capacitance (product of mass and specific heat) of a 2 U (89 mm) server and highlighted, for the first time, the need for developing a compact server model for transient simulations.
i] = thermal capacitance of the room air, J/[degrees]C (Btu/[degrees]F)
Note that with the current wall thermal capacitance and density, the wall surface temperatures remained low for a longer period while air temperature quickly reached 20[degrees]C.
MATHEMATICAL EXPRESSION OMITTED] where R = thermal resistance of chip C = thermal capacitance P = power dissipated at the junction of the device [tau] = thermal time constant (R x C) erfc = the complimentary error function,