For alloy FeC at the same temperature when the concentration of interstitial atoms increases, the

thermal expansion coefficient [[alpha].sub.T] and the heat capacity at constant pressure CP decrease.

Results revealed that the temperature effects on granodiorite can be described by interrelations between the bulk modulus and the

thermal expansion coefficient. The

thermal expansion coefficient influenced by stress, as well as the heat-transfer processes influenced by path, affects the rock thermomechanical behavior.

where w is the test function, [OMEGA] is the model domain, [GAMMA] is the domain boundary, t is the traction vector, superscripts +/- refer to the value of the corresponding parameters on opposite sides of the fracture surfaces, respectively, Ss is the specific storage, n is the porosity, [q.sub.H] is the volumetric Darcy flux, [beta] is the

thermal expansion coefficient, [Q.sub.H] is the fluid sink/source term between the fractures, [q.sub.T] is the heat flux, [c.sub.p] is the specific heat capacity, [b.sub.m] and [b.sub.h] are mechanical and hydraulic fracture apertures, [Q.sub.T] is the heat sink/source term, [alpha] is the

thermal expansion coefficient, [lambda] is the thermal conductivity, and d refers to the fracture plane.

When the heating rate increased from 5[degrees]C/min to 50[degrees]C/min, the longitudinal wave velocity decreased from 2.500 km/s to 0.704 km/s, with an amplitude of 15.49%; the density decreased from 2.32 g/[cm.sup.3] to 2.18 g/[cm.sup.3], with an amplitude of 6.02%; and the

thermal expansion coefficient increased linearly.

At fixed value of the

thermal expansion coefficient, by increasing Young's modulus of the insulate coating, the equivalent stress increases in the steel pipe and remains practically constant in both the polyethylene jacket and the insulate coating.

Thermal expansion coefficient value (a) of glass waste was determined by dilatometry measurements.

Bae et al developed a non-hydrolytic transparent composite with excellent transparency, heat resistance and a low

thermal expansion coefficient. This consists of a glass filler dispersed in a crosslinked transparent silicone resin produced by a non-hydrolytic reaction.

However, the problem of wafer bowing, which results from the difference in

thermal expansion coefficient between GaN epitaxial layer and sapphire, has become much more serious in larger-diameter wafers.

I think assuming that the material properties, particularly the

thermal expansion coefficient, of the metal plate are isotropic, the diameter of the hole will expand on heating.

There are four material properties that are of particular relevance for the different simulations: dynamic viscosity and heat capacity for the injection molding simulation; and

thermal expansion coefficient and modulus of elasticity for the thermoelastic simulation.