thermocompression bonding

thermocompression bonding

[¦thər·mō·kəm′presh·ən ′bänd·iŋ]
(engineering)
Use of a combination of heat and pressure to make connections, as when attaching beads to integrated-circuit chips; examples include wedge bonding and ball bonding.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive ?
With these combinations, we need to add thermocompression bonding, laser reflow, vacuum reflow, and maybe even vapor phase soldering to the tools necessary for successful assembly.
This includes wire bond, flip chip, thermocompression bonding, and together with NEXX's PVD and ECD equipment, we can offer film interconnect solutions inclusive of UBM (Under Bump Metallization), Cu Pillar (Fine Pitch Copper Pillar), TSV (Through Silicon Via) and RDL (Redistribution Layer), just to name a few," said Mr Lee Wai Kwong, CEO of ASMPT.
Using pulsed heat technology, the Uniflow3 provides targeted heating and precision temperature control for flex circuits, ribbon cables, wires, SMT components, single or dual sided edge connectors and thermocompression bonding of gold ribbon.
In addition, thermocompression bonding techniques are utilized for wafor-to-wafer interconnects and stacking of all Si layers.
In addition to the development of individual lateral and vertical interconnects, the component integration makes the power cube not only a densely integrated multi-layer circuit, but an integrated conformal package utilizing thermocompression bonding. The insertion loss from the MMIC amplifier to the microstrip array excitation is 1.8 to 2.4 dB, as shown in Figure 16.
Unlike wirebonding, and while the packages are in the tape format, all the inner leads are bonded simultaneously to the chip by means of thermocompression bonding.
Given the forecast for narrow bump pitch ([less than or equal to] 100 [micro]m) and increased use of Cu pillar bumps, many companies plan to use thermocompression bonding (TCB).
-- The printed sealing frames can create airtight seals by densifying the structure with thermocompression bonding at 200 degrees Celsius.
The instrument delivers targeted heating and temperature control for flex circuits, ribbon cables, wires, SMT components, single-or dual-sided edge connectors, and thermocompression bonding of gold ribbon via pulsed heat technology.
Other design features include components that are die attached with silver-filled conductive epoxy, interconnects made by thermocompression bonding of 1 mil diameter gold wire and a molding compound applied using dam and fill encapsulation of the component surface.
-- Printed sealing frames can create airtight seals by having a finer structure by thermocompression bonding at 200 degrees Celsius.