All of the resisters, capacitors and inductors were built on a three-layer, thick-film circuit with punched via holes and printed via holes.
In the past, polymer thick-film circuits have been used primarily for single-sided circuits with low circuit densities.
In addition, two types of via hole forming processes have been developed: one for double-sided and a second for multilayer thick-film circuits, both formed on thin flexible substrates.
HAVERHILL, MA - A US-based research firm and a Japanese PWB fabricator have reportedly developed a solderable thick-film circuit system on a thin flexible substrate.
According to DKN Research (dknresearch.com) and Ohtsu, Japan-based NY Industries, the new thick-film circuit system uses a specially formed conductive paste on heat-resistant substrates such as polyimide and PEN.
Currently, many thick-film circuit
production facilities are successfully printing 5 mil (125 [micro]m) lines and spaces, but the drive has been to go down to 3 mil (75 [micro]m) on a consistent basis.
The firms established a prototype service for trials with new printable electronics products, using printing equipment and other circuit manufacturing facilities, including roll-to-roll systems with broad ranges of thick-film circuit technologies.
Japan-based NY Industries is currently capable with a thick-film printing process for broad ranges of substrate materials for both rigid and flexible circuits; fine line traces down to 30 pm line and space; high-conductivity, thin thick-film traces down to 3 pm; single-side circuits, double-side circuits and multilayer up to eight layers; printed via holes with mechanically drilled holes and printed holes; solderable thick-film circuits; embedded resistors from 100 ohms to 10 megaohms; embedded capacitances up to 10,000 picofarads; embedded inductances with various constructions; and embedded EL devices with inorganic materials.
elements on ceramic can be either passively or actively laser trimmed.
The new design replaces four discrete FETs and numerous thin-film circuits with a monolithic IC and one FET plus one thick-film circuit
. A custom GaAs IC is well suited for signal distribution to multiple ports as it eliminates the need for large directional couplers and lowers the power-handling requirements on the output FET.
* Simple thick-film circuits
are lower in cost than thin films.
Designed to provide design engineers with high-power circuits and assemblies at lower costs than typical direct bonded copper methods, a technique to produce custom thick-film circuits
and assemblies has been developed.