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[′vē·ə or ′vī·ə]
A pathway that is etched to allow electrical contact between different layers of a semiconductor device.


(1) By means of, by way of. From Latin for "way" or "path."

(2) (Virtual Interface Architecture) See VI.

(3) (Vertical Interconnect Access) In a printed circuit board, a conducting pathway between two or more substrates (layers). The via is created by drilling through the board at the appropriate place where two or more layers will interconnect and allowing copper to run through the hole. The copper may coat only the sides of the hole or fill the entire hole. See printed circuit board.

(4) (Vertical Interconnect Access) In a chip, a conducting pathway between two or more layers. In a 3D chip, two or more stacked dice are connected via "through-silicon vias" (TSVs) which are pathways that pass completely through the die.

Creating Vias
In the antifuse programmable chip technology, a circuit is closed by turning non-conductive silicon into a conductive via. See antifuse.
References in periodicals archive ?
Chiou, and T.-L, Wu, "A new model for through-silicon vias on 3-D IC using conformal mapping method," IEEE Microw.
He, "Multiphysics characterization of transient electrothermomechanical responses of through-silicon vias applied with a periodic voltage pulse," IEEE Trans.
The collaboration with Belgium-based Imec ( provides design-for-test (DfT) and automatic test pattern generation technology said to ease testing of 3D-ICs with through-silicon via (TSV) functionality.
Aligning this layer and manufacturing it with the requisite number of through-silicon vias (TSVs) has historically been difficult - the interposer itself is a simple sheet of silicon, but wiring the interposer up properly and connecting it to all the requisite devices is difficult.
(NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion(R) module for deep silicon etch applications, including CMOS image sensors (CIS), interposers, and through-silicon vias (TSVs).
Future areas of collaboration include 3D through-silicon vias (TSVs) and silicon interposers (TSI), and micro-electro-mechanical systems (MEMS) MPW.