via

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via

[′vē·ə or ′vī·ə]
(electronics)
A pathway that is etched to allow electrical contact between different layers of a semiconductor device.

via

(1) By means of, by way of. From Latin for "way" or "path."

(2) (Virtual Interface Architecture) See VI.

(3) (Vertical Interconnect Access) In a printed circuit board, a conducting pathway between two or more substrates (layers). The via is created by drilling through the board at the appropriate place where two or more layers will interconnect and allowing copper to run through the hole. The copper may coat only the sides of the hole or fill the entire hole. See printed circuit board.

(4) (Vertical Interconnect Access) In a chip, a conducting pathway between two or more layers. In a 3D chip, two or more stacked dice are connected via "through-silicon vias" (TSVs) which are pathways that pass completely through the die.


Creating Vias
In the antifuse programmable chip technology, a circuit is closed by turning non-conductive silicon into a conductive via. See antifuse.
References in periodicals archive ?
We are delighted to close this deal with ALLVIA, a pioneer of 3D-IC technology since 1997, and the company that coined the industry term through-silicon via (TSV)," said Simon McElrea, president, Invensas Corporation.
The UniFire tool with its flexible application base and state-of-the-art performance enables our advanced packaging development, especially for through-silicon via processes," said Dr.
ESI research scientist Andy Hooper will present on "Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging Applications" on Wednesday, March 9, in an afternoon technical session.
System Plus Consulting also has also published their reverse costing report of the world's first 3-Axis MEMS accelerometer, supplied by STMicroelectronics and using through-silicon via (TSV) technology.
This workshop will bring together representatives from device manufacturers, electronic design automation suppliers, semiconductor assembly and test service providers, and the R&D community to explore mechanical stress-driven failure mechanisms, their associated test vehicles, and the characterization and modeling methodologies pertaining to via-middle through-silicon via 3D stacking technologies.
and its innovative 3D through-silicon via (TSV) technology to develop a high-performance ADC/DSP platform that has applications in fiber optic telecommunications, high performance RF sampling and filtering, test equipment and instrumentation, and sub-array processing for phased array radar systems.
Electronic Component and Semiconductor Industry : Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
TOKYO & GRENOBLE, France -- CEA-Leti and SPP Process Technology Systems (SPTS) today announced they have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA-Leti's 300mm facilities in Grenoble, France.