transistor chip

transistor chip

[tran′zis·tər ‚chip]
(electronics)
An unencapsulated transistor of very small size used in microcircuits.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive ?
These changes have enabled a GaN power transistor chip with operating current of over 50A, highest ever reported for vertical GaN transistors2, and high-frequency (several megahertz) operation.
For comparison of simplified and detailed model, the temperature was measured on the transistor chip.
Fujitsu achieved high frequency, high output, and high amplification in the amplifiers by developing "dual-side heat-dissipation" technology, in which heat is dissipated through both sides of the transistor chip, which is the source of the amplifier's heat output.
The first member of the SiByte family, the Broadcom BCM 1250, features two MIPS64 cores that scale from 600 MHz to 1GHz, up to 128Gbps bus bandwidth, a high-speed memory subsystem that supports up to peak 50Gbps memory bandwidth, and up to 30Gbps total I/O bandwidth tightly integrated onto a 60 million transistor chip. Key interfaces include three integrated Gigabit Ethernet MACs, PCI, HyperTransport, and generic I/O.
Gallium arsenide (GaAs) chips composed 33 percent of the 1999 market and heterojunction bipolar transistor chip sales showed strong growth during the same year.
The 23 million transistor chip runs at least 120MHz and features a 256- bit four pipe pixel rendering engine.
The transistor chip temperature must not exceed limiting value for reliable operation of inverter transistors, therefore, the power losses analysis and determination of means for their reduction is essential in the design of frequency converters.
In order to achieve high efficiency, the amplifier must have high gain - in other words, the performance of the transistor chip must be improved.
A Bell Labs research team may have extended the life of silicon- based transistor chip designs by removing one of the barriers to further shrinking the width of a transistor.
Conventionally, heat was dissipated through the use of what is known as the "face-up structure" (Figure 1), in which a high power transistor chip would be connected directly dice-bonded to the package and the heat would escape through the chip.