underfill

underfill

[′ən·dər‚fil]
(metallurgy)
A depression on the face of the weld which falls below the surface of the adjacent base metal.

underfill

A depression, on the face of a weld, which extends below the surface of the adjacent base metal.
References in periodicals archive ?
Transcend Information, Inc., a leading manufacturer of industrial-grade products, offers corner bond and underfill as customization options for its embedded products to increase reliability under high thermal or vibratory stress, high gravitational acceleration, and high fatigue cycle applications.
The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.
M2 PRESSWIRE-August 6, 2019-: Global Underfill Material Market Expected to Generate a Revenue of $535.56 Million During the Forecast Period, 2017-2026: Impacted by Rising Demand in Automative and Military Industries
Summary: Underfill Process is used for semiconductor for assembly and packaging.
If solder joints surrounded by underfill undergo reflow, or are close to reflow temperatures, the solder will expand/ extrude, then flow under pressure through any openings (FIGURE 1).
Summerville expects tough comps to persist through Q1 of FY19, but recommends for longer term investors to use the pullback to accumulate shares, citing the secular tailwinds of "mobile innovation, Internet of Things, 3D stacking, flip chip underfill, electronification of autos, shift to flexible circuitry, and healthy medical demand".
Investigation into the problem revealed that Apple removed the underfill from the controller chips that govern touchscreen functionality.
The SiT1568 also offers an innovative, in-system, auto-calibration feature that allows customers to eliminate timing inaccuracies introduced during system assembly, reflow, underfill, and overmolding.
overfill, underfill, ledge formation, perforations, apical transportation and/or instrument separation).
Underfill is recommended to mitigate the increased risks of mixed alloy soldering of area array packages.
Underfill encapsulant is usually described as linear and temperature independent, constant elastic material [15,16], or described as viscoelastic material around its glass transition temperature [T.sub.g] [17].
The new Spectrum H product family meets the needs of this market by driving mechanical and software improvements to achieve ultimate precision and accuracy in all three axes--X, Y, and Z--at speeds up to 30,000 dots per hour with a minimal footprint to maximize productivity per square meter." The Spectrum ll he is referring to enables consistent <200pm dots and solder paste line dispensing; features a tilt jetting capability for precision coating and underfill in hard-to-reach places; and offers non-contact laser height sensors for detecting surface heights and allowing tight dispense gaps for thin dispense lines.