wedge bonding

wedge bonding

[′wej ‚bänd·iŋ]
(engineering)
A type of thermocompression bonding in which a wedge-shaped tool is used to press a small section of the lead wire onto the bonding pad of an integrated circuit.
References in periodicals archive ?
In addition, the company has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings.
In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings.
Hesse and Knipps emphasized low loop wedge bonding for thin packages in one of the few wire-bond presentations.
Wedge bonding is a specific type of wire bonding that uses a wedge-shaped tool to create the welds.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices, as well as epoxy, laser weld and solder based attachment of actively aligned photonic devices.
A raw or unpackaged silicon chip is mounted directly on to a metallic heat sink using an adhesive and is then attached to the flex circuit using aluminium wedge bonding. Finally, the circuit is encapsulated to create a hermetically sealed low profile enclosure for the silicon chip.
It provides packaging solutions and in recent years has expanded its product offerings through acquisitions and development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of tools.
And, "We are able to dissipate an awful lot of heat." (Raby holds a patent in this technology.) He reports similar success with aluminum wedge bonding. "We have not had one failure.
Twenty-eight gigahertz FETs have pad sizes as small as 1.4 mil square, forcing round wire wedge bonding to be accomplished with 0.0007" Au wire.
In addition, the company said it has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings.
Where cost sensitivity is acute, either OSP over copper for solder-ability with selective nickel or gold plating on the bond sites, or simply a uniform nickel as a common soldering and bond site finish together with aluminum wedge bonding, provides the lowest-cost alternative.