wire bond

wire bond

The use of tiny wires that are soldered to the bare chip (bare die) on one end and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package.


Wire Bond vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps. (Image courtesy of Amkor Technology, Inc.)







Wire Bonding
This bare microcontroller chip from Microchip is approximately 4x5mm. It is mounted in this special glass package to show the wire bonds.
References in periodicals archive ?
3) Broken or missing wire bonds A broken wire bond may be a result of extreme mechanical or thermal stress applied to the part.
This calculates, for each run a total of 25 wire bond was done and an equal number of ball shear was implemented, this number if extended to the total set would sum up to 400 each for wire bonds and ball shears in each set of maximum, median and minimum surface roughness division.
Due to the absence of a wire bond and a hard epoxy layer, the wireless bonded LEDs are five times stronger and more robustly designed than standard, high power LEDs.
Hsieh, "Cu wire bond microstructure analysis and failure mechanism," Microelectronics Reliability, vol.
The company said that its xLC substrate is a sintered metal array of wire bond and die attach pads delivered on a temporary thin metal strip, called a lead carrier.
He reviews wire bond failure modes and mechanisms (mechanical, metallurgical, chemical, etc.); tests for detecting them; bonding machine parameters; solutions to bonding problems; and future directions in the field.
* Die metal suitable for an aluminum or gold wire bond.
The single-tier design allows STI to wire bond its semiconductor module, also fabricated by Endicott International, to the copper core, which in turn provides both heat dissipation and rigidity, according to Endicott Interconnect, which also supplies electronic interconnect solutions and electronic/mechanical equipment to medical device companies.
By eliminating the need for a wire bond, or an air bridge, this consistent, reliable, cost-effective solution is destined to become an important tool for circuit designers at high frequencies.
* In the "as plated" condition, there is no observable difference in the wire bond reliability performance of phos palladium vs.
Tucson, AZ, September 03, 2012 --(PR.com)-- Bruker announced today that a leading semiconductor supplier has purchased multiple Bruker ContourGT-X 3D optical microscope systems for their packaging factories in Asia and North America to support copper wire bond inspection and process control needs.