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wire bonding[′wīr ‚bänd·iŋ]
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.
wire bondThe use of tiny wires that are soldered to the bare chip (bare die) on one end and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package.
|Wire Bond vs. Flip Chip|
|In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps. (Image courtesy of Amkor Technology, Inc.)|
|This bare microcontroller chip from Microchip is approximately 4x5mm. It is mounted in this special glass package to show the wire bonds.|