wire bonding

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wire bonding

[′wīr ‚bänd·iŋ]
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.

wire bond

The use of tiny wires that are soldered to the bare chip (bare die) on one end and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package.

Wire Bond vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps. (Image courtesy of Amkor Technology, Inc.)

Wire Bonding
This bare microcontroller chip from Microchip is approximately 4x5mm. It is mounted in this special glass package to show the wire bonds.
References in periodicals archive ?
Wire bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during semiconductor device fabrication.
Metal structures can be tailored to meet individual requirements for soldering, wire bonding, electrical and thermal performance.
The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM and HBM DRAM packaging from wire bonding to advanced packaging architectures.
When using the current mainstream method wire bonding, it is difficult for heat to escape outside the component since the LED light emitting surface is at the top, imposing a limit on thermal dissipation.
* how our crystalline non-phosphorus electroless palladium deposits allow for wider wire bonding operating parameters
Overturning the common-sense notion that gold, which is expensive, should be used as an interconnection material--a notion that has existed since the invention of wire bonding technology by Bell Laboratories in 1957--Wire Technology Co.
SPIL is the world's third largest IC assembly and testing house, with wire bonding, flip-chip, wafer level packaging, bumping, multichip package and high-level assembly and testing technology.
Included in the upcoming schedule is Wire Bonding Certification (August 25-27 Bethlehem, PA), Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules (Sept 15-18 Pasadena, CA) and Microwave Packaging Technology (Dec 7-9 San Diego, CA).
"Therefore, designing a new wire bonding scheme for a power semiconductor usually requires a simulation specialist, who needs to spend time setting up the model and analysing the temperature increase under a variety of conditions.
Abstract: While it is true that some have called electroless nickel electroless palladium immersion gold (ENEPIG) a "universal finish" for a range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes.
Both options, if available, must be used carefully, as manufacturers can change the leadframe structure, die she, and wire bonding schemes without notice.