wire bonding


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wire bonding

[′wīr ‚bänd·iŋ]
(electricity)
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
(electronics)
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.
References in periodicals archive ?
Overturning the common-sense notion that gold, which is expensive, should be used as an interconnection material--a notion that has existed since the invention of wire bonding technology by Bell Laboratories in 1957--Wire Technology Co.
Kulicke and Soffa Industries Inc (K&S) (NASDAQ:KLIC), a company that designs and manufactures semiconductor and LED assembly equipment, on Wednesday announced the launch of the Quantis QFN Capillary, a copper wire bonding capillary.
The article discusses the two areas of wire bonding, the wire bonding process itself (wire bond statistics ) and the long-term reliability of the device.
Both options, if available, must be used carefully, as manufacturers can change the leadframe structure, die she, and wire bonding schemes without notice.
Successful gold wire bonding is achieved between a gold wire and a clean soft gold surface finish.
Industry executives pointed out that both the company's 2010 net income and EPS results topped expectations mostly thanks to increased contracts from integrated device manufacturers (IDMs), surged contracts for its copper wire bonding service, and its merger with Universal Scientific Industrial Co.
In this update of the 1997 and 1989 editions, Harman (retired, Fellow of the National Institute of Standards and Technology) presents new material based on recent technical areas and technologies in the field of wire bonding and frequently asked questions.
Within mainstream surface mount assembly, bare die wire bonding directly to the PCB substrate and adjacent to other soldered components has long been practiced for low end to high performance assemblies.
Typical uses for the 8000 will be wire bonding for microelectronic packaging including most semiconductor-based interconnect applications.
The MMIC is mounted on a chip carrier using standard wire bonding.
Objective: To determine the thickness of Pd in ENEPIG for soldering and wire bonding applications.