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LGA

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LGA

(Land Grid Array) A chip package with a very high density of contacts. LGAs differ from traditional chips with protruding pins that are inserted into a socket. An LGA chip has flat pads on the bottom of its package that touch contacts on the motherboard socket.


A Core i7 Chip
This Intel Core i7 chip uses an LGA package with 1,366 contacts, providing a very high density of pathways to the motherboard. Notice that the chip package contains pads rather than pins. (Image courtesy of Intel Corporation.)
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References in periodicals archive
Abstract: This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC 105 and 63Sn37Pb solder alloys in vibration loading conditions.
In Case You Missed It
Its extremely small 248-pin Land Grid Array (LGA) format measuring just 24.8mm by 35.6mm by 2.6mm meets the size/weight/power limitations of in-car applications.
u blox delivers secure automotive telematics modules
Its extremely small 248-pin Land Grid Array (LGA) format, measuring just 24.8mm by 35.6mm by 2.6mm, meets the size/weight/power limitations of in-car applications.
u-blox introduces TOBY-L4 series of Automotive Grade telematics modules
Taipei, Taiwan, May 13, 2017 --(PR.com)-- SparkLAN Communications, Inc., a broadband wireless networking solution provider ships the wireless 802.11ac/a/b/g/n Dual-Band (2.4GHz / 5GHz) M.2 Card that combines Bluetooth , adopt LGA (Land grid array) packaging technology.
SparkLAN Launches WNSQ-261ACN(BT) 802.11ac/a/b/g/n with MU-MIMO Wi-Fi +Bluetooth 4.1 Combo M.2 LGA Type Module
Offered in a small 4.5- x 4.4-mm land grid array package, the ultra-low power AS7262 visible range sensor and the AS7263 NIR sensor each provide six calibrated spectral channels.
Digital multispectral sensor-on-chip
Recommended for mid to high-volume, size sensitive applications, the CE910-DUAL has a compact 28.2 x 28.2 x 2.05 mm Land Grid Array (LGA) package.
TELIT LAUNCHES CDMA 1XRTT IOT MODULE IN U.S
Microprocessors migrated to lands, remaining a socketed solution, but with the introduction of Intel's Haswell processor for laptops, the migration from land grid array (LGA) to plastic ball grid array (PBGA) has taken off.
Organic substrates for IC Packages: the Era continues cost remains king, even as buildup substrates take hold
The solution is housed in a 4 x 4 x 1 millimeter (mm), halogen and lead free, restriction of hazardous substances compliant, moisture sensitivity level, 3 land grid array package.
SKYWORKS FRONT END SOLUTIONS SUPPORTS BROADCOM 5G WIFI
Utilizing Land Grid Array (LGA) packaging technology, AVX's new 10W 3dB directional couplers feature an inherently low profile, low parasitics, excellent solderability, and improved heat dissipation in addition to self-alignment during reflow.
AVX DEBUTS THIN-FILM 10W 3DB DIRECTIONAL COUPLERS
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