Furthermore, W/O/W and O/W/O double emulsions were generated using pattern wettability to reflect its efficiency [7].To the best of the author's knowledge, there are minimal studies been done towards the relationships between the process parameters and the wettability effect, hence this paper studies the relationship between controllable process parameters and wetability of the etched Platinum
metallization layer after Reactive Ion Etching (RIE).
This cell is built up using thick-film production techniques, in which an array of fine current-collector fingers are deposited on the top side of the substrate, an aluminum
metallization layer applied to the bottom side, and then a series of wider bus bars created for electrical interconnection purposes.
Measurements of thermal expansion of a thin Al
metallization layer of 3 [micro]m thickness were carried out on Si substrates with 300 [micro]m thickness for different industrial chips, which were prepared from the commercial modules after removing the bonding wires.
As a result of diffusion of these elements compaction of the upper
metallization layer occurs.
4.5 [micro]m, gold
metallization layer. These two additions provide the MLP advantages.
The MLP process differs from a more standard wafer processing in that it incorporates the addition of a second low dielectric constant polyimide layer and a second thick gold
metallization layer. The additional polyimide layer offers the flexibility to locate transmission lines on polyimide up to 10 [micro]m thick.
The plasma FIB and proprietary Dx chemistry is used to expose
metallization layers, allowing electrical fault isolation and analysis to be performed with the vendor's nanoprobing tools.
The 45-nm SOI process offers four transistor options (Regular, High Vt, Super High Vt, Ultra High Vt), in addition to up to 11
metallization layers. A range of SRAM (Static Random Access Memory) and embedded DRAM (Dynamic Random Access Memory) options are also available, as well as a number of ESD (Electrostatic Discharge) protection options and high-quality passive elements.
* The resultant
metallization layers and vias are hermetic
The circuit definition is completed by adding the
metallization layers, including metal conductivity and thickness, to the substrate structure.